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DC and AC analyses of a printed flexible memory device

Printed flexible cross-bar memory devices were characterized by both DC and AC techniques for their voltage triggered bi-stable behaviour and for interface properties between printed functional layers.

出版机构:Elsevier Science

刊物名称:Organic Electronics

出版时间:2010

ISSN:1566-1199

数据源:报刊文摘

Topological control of the spin coupling in dinuclear copper(II) complexes with meta- and para-phenylenediamine bridging ligands

8(3) 79.2(2) (1) and 80.9(2) 86.5(2)� (3)]. Variable-temperature magnetic susceptibility measurements on the dinuclear complexes 2 and 3 show the occurrence of moderate ferromagnetic (J =+8.3cm 1, 2) and strong antiferromagnetic (J = 51.

出版机构:Elsevier Science

刊物名称:Inorganica Chimica Acta

出版时间:2010

ISSN:0020-1693

数据源:报刊文摘

Two isomers containing a [Cu(Me2bpzb)] unit: Molecule (0-D) and 1-D

Two isomers (molecule 1 and 1-D 2) containing [Cu(Me2bpzb)] units have been obtained under the different reaction conditions, and their structures have been determined by X-ray crystallography.

出版机构:Elsevier Science

刊物名称:Inorganic Chemistry Communications

出版时间:2010

ISSN:1387-7003

数据源:报刊文摘

Dicyanamido-metal(II) complexes. Part 5 † † For part 4 see ref. . : First example for a unit cell containing dinuclear and 1-D polymeric Cu(II) complexes bridging by dicyanamide

The reaction of Cu(ClO4)2, N,N,N?,N?,N?-pentamethylethylenetriamine (pmedien) and sodium dicyanamide (Nadca) in aqueous medium led to the isolation of {[Cu(pmedien)(?1,5-dca)]2(ClO4)2,[Cu(pmedien)(?1,5-dca)]n(ClO4)n} (1). The complex was structurally and magnetically characterized.

出版机构:Elsevier Science

刊物名称:Inorganic Chemistry Communications

出版时间:2010

ISSN:1387-7003

数据源:报刊文摘

New chemical methods for the deposition of Cu1·8S and TlSe thin film

AbstractNew chemical methods for the deposition of thin film of Cu1?8S and TlSe have been developed. The deposition of Cu1?

出版机构:Indian Academy of Sciences

刊物名称:Bulletin of Materials Science

出版时间:1981

ISSN:0250-4707

数据源:报刊文摘

Synthesis, structure and properties of a new copper (II) complex, [Cu2(4,4′-bpy)5(H2O)4](ClO4)4(4,4′-bpy)(DMF)2(H2O)2

new copper (II) complex with formula [Cu2(4,4?-bpy)5(H2O)4](ClO4)4(4,4?-bpy)(DMF)2(H2O)2 has been synthesized by reaction of 4,4?-bpyridine (4,4?-bpy) with Cu(ClO4)2.

出版机构:Elsevier Science

刊物名称:Inorganic Chemistry Communications

出版时间:2010

ISSN:1387-7003

数据源:报刊文摘

Copper(II) complexes derived from di-2-pyridyl ketone-N 4-phenyl-3-semicarbazone: Synthesis and spectral studies

Five copper(II) complexes [CuLCl]2?CuCl2?4H2O (1), [CuLOAc] (2), [CuLNO3]2 (3), [CuLN3] (4) and [CuLNCS]?3/2H2O (5) of di-2-pyridyl ketone-N 4-phenyl-3-semicarbazone (HL) were synthesized and characterized by elemental analyses and electronic, infrared and EPR spectral techniques.

出版机构:Elsevier Science

刊物名称:Spectrochimica Acta Part A: Molecular and Biomolecular Spectroscopy

出版时间:2010

ISSN:1386-1425

数据源:报刊文摘

Alterations in dimethylsulfoniopropionate (DMSP) levels in the coral Montastraea franksi in response to copper exposure

Symbiotic corals routinely experience hyperoxic conditions within their tissues due to the photosynthesis of the endosymbiotic dinoflagellate microalgae (Symbiodinium spp.). Symbiodinium spp. produce high intracellular levels of the osmolyte dimethylsulfoniopropionate (DMSP).

出版机构:Elsevier Science

刊物名称:Aquatic Toxicology

出版时间:2010

ISSN:0166-445X

数据源:报刊文摘

Adsorption of thiourea on polycrystalline platinum: Influence on electrodeposition of copper

lthough previous works have shown the marked influence of thiourea as an organic additive in electrolyte bulk on copper electrodeposition, a variety of mechanisms could be responsible. The present paper concerns the effect of a thiourea layer adsorbed prior to copper electrodeposition.

出版机构:Elsevier Science

刊物名称:Surface and Coatings Technology

出版时间:2010

ISSN:0257-8972

数据源:报刊文摘

High rate of copper electrodeposition from the hexafluorosilicate bath

high-rate copper electrodeposition performed from a hexafluorosilicate bath is presented in this article. It is shown that the current density for electrodeposition ranges from 1 to 30Adm?2 and the optimal suggested current density is 15Adm?2 or a rate of 200?m h?1.

出版机构:Elsevier Science

刊物名称:Surface and Coatings Technology

出版时间:2010

ISSN:0257-8972

数据源:报刊文摘